Logo
-

Byte Open Security

(ByteOS Network)

Log In

Sign Up

ByteOS

Security
Vulnerability Details
Registries
Custom Views
Weaknesses
Attack Patterns
Filters & Tools
Vulnerability Details :

CVE-2018-11855

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-11 Feb, 2019 | 15:00
Updated At-05 Aug, 2024 | 08:17
Rejected At-
Credits

If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:11 Feb, 2019 | 15:00
Updated At:05 Aug, 2024 | 08:17
Rejected At:
▼CVE Numbering Authority (CNA)

If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Versions
Affected
  • MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660
Problem Types
TypeCWE IDDescription
textN/APotential Buffer Overflow in OCE Code
Type: text
CWE ID: N/A
Description: Potential Buffer Overflow in OCE Code
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins
Resource:
x_refsource_CONFIRM
▼Authorized Data Publishers (ADP)
CVE Program Container
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
x_transferred
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins
Resource:
x_refsource_CONFIRM
x_transferred
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:11 Feb, 2019 | 15:29
Updated At:21 Feb, 2019 | 21:10

If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Primary3.07.8HIGH
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Primary2.07.2HIGH
AV:L/AC:L/Au:N/C:C/I:C/A:C
Type: Primary
Version: 3.0
Base score: 7.8
Base severity: HIGH
Vector:
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Type: Primary
Version: 2.0
Base score: 7.2
Base severity: HIGH
Vector:
AV:L/AC:L/Au:N/C:C/I:C/A:C
CPE Matches

Qualcomm Technologies, Inc.
qualcomm
>>mdm9607_firmware>>-
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9607>>-
cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9650_firmware>>-
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9650>>-
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9655_firmware>>-
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9655>>-
cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8996au_firmware>>-
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8996au>>-
cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_210_firmware>>-
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_210>>-
cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_212_firmware>>-
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_212>>-
cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_205_firmware>>-
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_205>>-
cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_410_firmware>>-
cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_410>>-
cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_412_firmware>>-
cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_412>>-
cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_636_firmware>>-
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_636>>-
cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_820_firmware>>-
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_820>>-
cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_820a_firmware>>-
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_820a>>-
cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_835_firmware>>-
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_835>>-
cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_8cx_firmware>>-
cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_8cx>>-
cpe:2.3:h:qualcomm:sd_8cx:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sda660_firmware>>-
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sda660>>-
cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sdm630_firmware>>-
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sdm630>>-
cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sdm660_firmware>>-
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sdm660>>-
cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-190Primarynvd@nist.gov
CWE ID: CWE-190
Type: Primary
Source: nvd@nist.gov
Evaluator Description

Evaluator Impact

Evaluator Solution

Vendor Statements

References
HyperlinkSourceResource
https://www.qualcomm.com/company/product-security/bulletinsproduct-security@qualcomm.com
Vendor Advisory
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins
Source: product-security@qualcomm.com
Resource:
Vendor Advisory

Change History

0
Information is not available yet

Similar CVEs

0Records found

Details not found