CVE-2019-10622 | ByteOS Network

Vulnerability Details :

CVE-2019-10622

Assigner-qualcomm

Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f

Published At-16 Apr, 2020 | 10:46

Updated At-04 Aug, 2024 | 22:32

Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130

EPSS History

Score

Latest Score

-

N/A

Percentile

Latest Percentile

-

N/A

▼Common Vulnerabilities and Exposures (CVE)

Assigner:qualcomm

Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f

Published At:16 Apr, 2020 | 10:46

Updated At:04 Aug, 2024 | 22:32

▼CVE Numbering Authority (CNA)

Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130

Affected Products

Vendor

Qualcomm Technologies, Inc.

Product

Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking

Versions

Affected

APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130

Problem Types

Type	CWE ID	Description
text	N/A	Buffer Over-read issue in Audio

Type: text

CWE ID: N/A

Description: Buffer Over-read issue in Audio

References

Hyperlink	Resource
https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin	x_refsource_CONFIRM

Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin

Resource:

x_refsource_CONFIRM

▼Authorized Data Publishers (ADP)

CVE Program Container

References

Hyperlink	Resource
https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin	x_refsource_CONFIRM x_transferred

Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin

Resource:

x_refsource_CONFIRM

x_transferred

▼National Vulnerability Database (NVD)

Source:product-security@qualcomm.com

Published At:16 Apr, 2020 | 11:15

Updated At:22 Apr, 2020 | 14:51

Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130

Metrics

Type	Version	Base score	Base severity	Vector
Primary	3.1	9.1	CRITICAL	CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:H
Primary	2.0	3.6	LOW	AV:L/AC:L/Au:N/C:P/I:N/A:P

Type: Primary

Version: 3.1

Base score: 9.1

Base severity: CRITICAL

Vector:

CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:H

Type: Primary

Version: 2.0

Base score: 3.6

Base severity: LOW

Vector:

AV:L/AC:L/Au:N/C:P/I:N/A:P

CPE Matches

Qualcomm Technologies, Inc.

>>apq8009_firmware>>-

cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:apq8009:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>apq8096au_firmware>>-

cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:apq8096au:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>ipq4019_firmware>>-

cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:ipq4019:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>ipq6018_firmware>>-

cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:ipq6018:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>ipq8064_firmware>>-

cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:ipq8064:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>ipq8074_firmware>>-

cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:ipq8074:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>mdm9206_firmware>>-

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>mdm9207c_firmware>>-

cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:mdm9207c:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>mdm9607_firmware>>-

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>mdm9640_firmware>>-

cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>mdm9650_firmware>>-

cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:qcn7605:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qcn7605_firmware>>-

cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qcs605_firmware>>-

cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:sc8180x:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sc8180x_firmware>>-

cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:sdm710:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdm710_firmware>>-

cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdx24>>-

cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdx24_firmware>>-

cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdx55>>-

cpe:2.3:h:qualcomm:sdx55:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdx55_firmware>>-

cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:sm8150:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sm8150_firmware>>-

cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sm8250_firmware>>-

cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:sm8250:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2130_firmware>>-

cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

cpe:2.3:h:qualcomm:sxr2130:-:*:*:*:*:*:*:*

Weaknesses

CWE ID	Type	Source
CWE-125	Primary	nvd@nist.gov

CWE ID: CWE-125

Type: Primary

Source: nvd@nist.gov

References

Hyperlink	Source	Resource
https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin	product-security@qualcomm.com	Patch Vendor Advisory

Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin

Source: product-security@qualcomm.com

Resource:

Patch

Vendor Advisory