Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Memory corruption while invoking callback function of AFE from ADSP.
Memory corruption while sending SMS from AP firmware.
Memory corruption in Core while processing control functions.
Memory corruption in HLOS while converting from authorization token to HIDL vector.
Memory Corruption in Audio while invoking callback function in driver from ADSP.
Memory corruption in HLOS while running playready use-case.
Possible buffer overflow due to lack of validation for the length of NAI string read from EFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.
Memory corruption while processing finish_sign command to pass a rsp buffer.
Possible buffer overflow due to lack of input IB amount validation while processing the user command in Snapdragon Auto
Memory corruption in Audio while processing IIR config data from AFE calibration block.
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
Memory corruption when user provides data for FM HCI command control operations.
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
Memory corruption in Core while processing RX intent request.
Memory corruption in wearables while processing data from AON.
Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine.
Memory Corruption in SPS Application while exporting public key in sorter TA.
Memory corruption in WLAN Host while setting the PMK length in PMK length in internal cache.
Memory corruption while processing the IOCTL FM HCI WRITE request.
Memory corruption in HLOS while running kernel address sanitizers (syzkaller) on tmecom with DEBUG_FS enabled.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Memory corruption while copying the sound model data from user to kernel buffer during sound model register.
Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.
Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.
Memory corruption while querying module parameters from Listen Sound model client in kernel from user space.
Memory corruption when the bandpass filter order received from AHAL is not within the expected range.
Memory corruption due to buffer copy without checking the size of input while loading firmware in Linux Kernel.
Improper buffer initialization on the backend driver can lead to buffer overflow in Snapdragon Auto
Memory corruption while processing audio effects.
Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Buffer overflow in sahara protocol while processing commands leads to overwrite of secure configuration data in Snapdragon Mobile, Snapdragon Compute, Snapdragon Auto, Snapdragon IOT, Snapdragon Connectivity, Snapdragon Voice & Music
Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Improper validation of maximum size of data write to EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Possible heap Memory Corruption Issue due to lack of input validation when sending HWTC IQ Capture command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
When a fake broadcast/multicast 11w rmf without mmie received, since no proper length check in wma_process_bip, buffer overflow will happen in both cds_is_mmie_valid and qdf_nbuf_trim_tail in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8937, MSM8996AU, MSM8998, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS605, SDM630, SDM636, SDM660, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Memory corruption in Core Platform while printing the response buffer in log.
Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.
Memory corruption in FM Host due to buffer copy without checking the size of input in FM Host
Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile
Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command.
Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory.
Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.