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Vulnerability Details :

CVE-2021-30298

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-03 Jan, 2022 | 07:26
Updated At-03 Aug, 2024 | 22:32
Rejected At-
Credits

Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:03 Jan, 2022 | 07:26
Updated At:03 Aug, 2024 | 22:32
Rejected At:
▼CVE Numbering Authority (CNA)

Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Versions
Affected
  • AR8031, AR8035, CSRA6620, CSRA6640, FSM10055, FSM10056, IPQ8072A, IPQ8074A, IPQ8076A, MDM9150, QCA6390, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8337, QCN9000, QCN9074, QCS405, QCS410, QCS610, QRB5165, QRB5165N, Qualcomm215, SA8155P, SD205, SD210, SD460, SD662, SD665, SD765, SD765G, SD768G, SD865 5G, SD870, SDA429W, SDX55, SDX55M, SM7250P, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN3999, WCN6850, WCN6851, WSA8810, WSA8815, WSA8830, WSA8835
Problem Types
TypeCWE IDDescription
textN/ABuffer Copy Without Checking Size of Input in DIAG Services
Type: text
CWE ID: N/A
Description: Buffer Copy Without Checking Size of Input in DIAG Services
Metrics
VersionBase scoreBase severityVector
3.16.7MEDIUM
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Version: 3.1
Base score: 6.7
Base severity: MEDIUM
Vector:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin
x_refsource_CONFIRM
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin
Resource:
x_refsource_CONFIRM
▼Authorized Data Publishers (ADP)
CVE Program Container
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin
x_refsource_CONFIRM
x_transferred
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin
Resource:
x_refsource_CONFIRM
x_transferred
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:03 Jan, 2022 | 08:15
Updated At:12 Jan, 2022 | 15:41

Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Primary3.17.8HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Secondary3.16.7MEDIUM
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Primary2.04.6MEDIUM
AV:L/AC:L/Au:N/C:P/I:P/A:P
Type: Primary
Version: 3.1
Base score: 7.8
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Type: Secondary
Version: 3.1
Base score: 6.7
Base severity: MEDIUM
Vector:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Type: Primary
Version: 2.0
Base score: 4.6
Base severity: MEDIUM
Vector:
AV:L/AC:L/Au:N/C:P/I:P/A:P
CPE Matches

Qualcomm Technologies, Inc.
qualcomm
>>ar8031>>-
cpe:2.3:h:qualcomm:ar8031:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8031_firmware>>-
cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8035>>-
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8035_firmware>>-
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>csra6620_firmware>>-
cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>csra6620>>-
cpe:2.3:h:qualcomm:csra6620:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>csra6640_firmware>>-
cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>csra6640>>-
cpe:2.3:h:qualcomm:csra6640:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fsm10055_firmware>>-
cpe:2.3:o:qualcomm:fsm10055_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fsm10055>>-
cpe:2.3:h:qualcomm:fsm10055:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fsm10056_firmware>>-
cpe:2.3:o:qualcomm:fsm10056_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fsm10056>>-
cpe:2.3:h:qualcomm:fsm10056:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ipq8072a_firmware>>-
cpe:2.3:o:qualcomm:ipq8072a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ipq8072a>>-
cpe:2.3:h:qualcomm:ipq8072a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ipq8074a_firmware>>-
cpe:2.3:o:qualcomm:ipq8074a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ipq8074a>>-
cpe:2.3:h:qualcomm:ipq8074a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ipq8076a_firmware>>-
cpe:2.3:o:qualcomm:ipq8076a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ipq8076a>>-
cpe:2.3:h:qualcomm:ipq8076a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9150_firmware>>-
cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9150>>-
cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6390_firmware>>-
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6390>>-
cpe:2.3:h:qualcomm:qca6390:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391_firmware>>-
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391>>-
cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6574au_firmware>>-
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6574au>>-
cpe:2.3:h:qualcomm:qca6574au:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6595au_firmware>>-
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6595au>>-
cpe:2.3:h:qualcomm:qca6595au:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6696_firmware>>-
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6696>>-
cpe:2.3:h:qualcomm:qca6696:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8337_firmware>>-
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8337>>-
cpe:2.3:h:qualcomm:qca8337:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn9000_firmware>>-
cpe:2.3:o:qualcomm:qcn9000_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn9000>>-
cpe:2.3:h:qualcomm:qcn9000:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn9074_firmware>>-
cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn9074>>-
cpe:2.3:h:qualcomm:qcn9074:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs405_firmware>>-
cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs405>>-
cpe:2.3:h:qualcomm:qcs405:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs410_firmware>>-
cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs410>>-
cpe:2.3:h:qualcomm:qcs410:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs610_firmware>>-
cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs610>>-
cpe:2.3:h:qualcomm:qcs610:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qrb5165_firmware>>-
cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qrb5165>>-
cpe:2.3:h:qualcomm:qrb5165:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qrb5165n_firmware>>-
cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qrb5165n>>-
cpe:2.3:h:qualcomm:qrb5165n:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qualcomm215_firmware>>-
cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qualcomm215>>-
cpe:2.3:h:qualcomm:qualcomm215:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8155p_firmware>>-
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8155p>>-
cpe:2.3:h:qualcomm:sa8155p:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-120Primarynvd@nist.gov
CWE ID: CWE-120
Type: Primary
Source: nvd@nist.gov
Evaluator Description

Evaluator Impact

Evaluator Solution

Vendor Statements

References
HyperlinkSourceResource
https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletinproduct-security@qualcomm.com
Patch
Vendor Advisory
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin
Source: product-security@qualcomm.com
Resource:
Patch
Vendor Advisory

Change History

0
Information is not available yet

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