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Vulnerability Details :

CVE-2023-21666

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-02 May, 2023 | 05:08
Updated At-02 Aug, 2024 | 09:44
Rejected At-
Credits

Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics

Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:02 May, 2023 | 05:08
Updated At:02 Aug, 2024 | 09:44
Rejected At:
▼CVE Numbering Authority (CNA)
Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics

Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon
Platforms
  • Snapdragon Auto
  • Snapdragon Compute
  • Snapdragon Connectivity
  • Snapdragon Consumer IOT
  • Snapdragon Industrial IOT
  • Snapdragon Mobile
  • Snapdragon Voice & Music
  • Snapdragon Wearables
Default Status
unaffected
Versions
Affected
  • 315 5G IoT Modem
  • 9206 LTE Modem
  • APQ8017
  • AQT1000
  • AR8031
  • AR8035
  • C-V2X 9150
  • CSRA6620
  • CSRA6640
  • CSRB31024
  • FastConnect 6200
  • FastConnect 6800
  • FastConnect 6900
  • Flight RB5 5G Platform
  • Home Hub 100 Platform
  • MDM9250
  • MDM9628
  • MDM9650
  • MSM8108
  • MSM8209
  • MSM8608
  • MSM8909W
  • QCA6174
  • QCA6174A
  • QCA6310
  • QCA6320
  • QCA6335
  • QCA6391
  • QCA6420
  • QCA6421
  • QCA6426
  • QCA6430
  • QCA6431
  • QCA6436
  • QCA6564
  • QCA6564A
  • QCA6564AU
  • QCA6574
  • QCA6574A
  • QCA6574AU
  • QCA6595
  • QCA6595AU
  • QCA6696
  • QCA8337
  • QCA9367
  • QCA9377
  • QCA9379
  • QCM2290
  • QCM4290
  • QCM6125
  • QCN9011
  • QCN9012
  • QCN9074
  • QCS2290
  • QCS410
  • QCS4290
  • QCS610
  • QCS6125
  • QCS8155
  • QCS8250
  • QRB5165M
  • QRB5165N
  • QSM8250
  • Qualcomm 205 Mobile Platform
  • Qualcomm 215 Mobile Platform
  • Robotics RB3 Platform
  • Robotics RB5 Platform
  • SA6145P
  • SA6150P
  • SA6155
  • SA6155P
  • SA8145P
  • SA8150P
  • SA8155
  • SA8155P
  • SA8195P
  • SD 675
  • SD626
  • SD660
  • SD670
  • SD675
  • SD730
  • SD835
  • SD855
  • SD865 5G
  • SDM429W
  • SDX20M
  • SDX55
  • SM4125
  • SM6250
  • SM6250P
  • SM7250P
  • Smart Audio 200 Platform
  • Smart Audio 400 Platform
  • Smart Display 200 Platform (APQ5053-AA)
  • Snapdragon 1200 Wearable Platform
  • Snapdragon 208 Processor
  • Snapdragon 210 Processor
  • Snapdragon 212 Mobile Platform
  • Snapdragon 425 Mobile Platform
  • Snapdragon 429 Mobile Platform
  • Snapdragon 439 Mobile Platform
  • Snapdragon 450 Mobile Platform
  • Snapdragon 460 Mobile Platform
  • Snapdragon 625 Mobile Platform
  • Snapdragon 626 Mobile Platform
  • Snapdragon 632 Mobile Platform
  • Snapdragon 660 Mobile Platform
  • Snapdragon 662 Mobile Platform
  • Snapdragon 665 Mobile Platform
  • Snapdragon 670 Mobile Platform
  • Snapdragon 675 Mobile Platform
  • Snapdragon 678 Mobile Platform (SM6150-AC)
  • Snapdragon 680 4G Mobile Platform
  • Snapdragon 685 4G Mobile Platform (SM6225-AD)
  • Snapdragon 690 5G Mobile Platform
  • Snapdragon 710 Mobile Platform
  • Snapdragon 720G Mobile Platform
  • Snapdragon 730 Mobile Platform (SM7150-AA)
  • Snapdragon 730G Mobile Platform (SM7150-AB)
  • Snapdragon 732G Mobile Platform (SM7150-AC)
  • Snapdragon 750G 5G Mobile Platform
  • Snapdragon 765 5G Mobile Platform (SM7250-AA)
  • Snapdragon 765G 5G Mobile Platform (SM7250-AB)
  • Snapdragon 768G 5G Mobile Platform (SM7250-AC)
  • Snapdragon 820 Automotive Platform
  • Snapdragon 835 Mobile PC Platform
  • Snapdragon 845 Mobile Platform
  • Snapdragon 855 Mobile Platform
  • Snapdragon 855+/860 Mobile Platform (SM8150-AC)
  • Snapdragon 865 5G Mobile Platform
  • Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
  • Snapdragon 870 5G Mobile Platform (SM8250-AC)
  • Snapdragon Auto 5G Modem-RF
  • Snapdragon Wear 2100 Platform
  • Snapdragon Wear 2500 Platform
  • Snapdragon Wear 3100 Platform
  • Snapdragon Wear 4100+ Platform
  • Snapdragon X20 LTE Modem
  • Snapdragon X24 LTE Modem
  • Snapdragon X5 LTE Modem
  • Snapdragon X50 5G Modem-RF System
  • Snapdragon X55 5G Modem-RF System
  • Snapdragon XR1 Platform
  • Snapdragon XR2 5G Platform
  • Snapdragon XR2+ Gen 1 Platform
  • Snapdragon Auto 4G Modem
  • SXR1120
  • SXR2130
  • Vision Intelligence 100 Platform (APQ8053-AA)
  • Vision Intelligence 200 Platform (APQ8053-AC)
  • Vision Intelligence 400 Platform
  • WCD9326
  • WCD9330
  • WCD9335
  • WCD9340
  • WCD9341
  • WCD9370
  • WCD9371
  • WCD9375
  • WCD9380
  • WCD9385
  • WCN3610
  • WCN3615
  • WCN3620
  • WCN3660
  • WCN3660B
  • WCN3680
  • WCN3680B
  • WCN3910
  • WCN3950
  • WCN3980
  • WCN3988
  • WCN3990
  • WCN3999
  • WSA8810
  • WSA8815
  • WSA8830
  • WSA8835
Problem Types
TypeCWE IDDescription
CWECWE-401CWE-401 Improper Release of Memory Before Removing Last Reference ('Memory Leak')
Type: CWE
CWE ID: CWE-401
Description: CWE-401 Improper Release of Memory Before Removing Last Reference ('Memory Leak')
Metrics
VersionBase scoreBase severityVector
3.18.4HIGH
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Version: 3.1
Base score: 8.4
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
N/A
http://packetstormsecurity.com/files/172664/Qualcomm-Adreno-KGSL-Data-Leakage.html
N/A
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
Resource: N/A
Hyperlink: http://packetstormsecurity.com/files/172664/Qualcomm-Adreno-KGSL-Data-Leakage.html
Resource: N/A
▼Authorized Data Publishers (ADP)
CVE Program Container
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
x_transferred
http://packetstormsecurity.com/files/172664/Qualcomm-Adreno-KGSL-Data-Leakage.html
x_transferred
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
Resource:
x_transferred
Hyperlink: http://packetstormsecurity.com/files/172664/Qualcomm-Adreno-KGSL-Data-Leakage.html
Resource:
x_transferred
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:02 May, 2023 | 06:15
Updated At:12 Apr, 2024 | 17:16

Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Primary3.17.8HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Secondary3.18.4HIGH
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Type: Primary
Version: 3.1
Base score: 7.8
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Type: Secondary
Version: 3.1
Base score: 8.4
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
CPE Matches

Qualcomm Technologies, Inc.
qualcomm
>>wcn3998_firmware>>-
cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn3998>>-
cpe:2.3:h:qualcomm:wcn3998:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6390_firmware>>-
cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6390>>-
cpe:2.3:h:qualcomm:qca6390:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-5_firmware>>-
cpe:2.3:o:qualcomm:wcn685x-5_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-5>>-
cpe:2.3:h:qualcomm:wcn685x-5:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-1_firmware>>-
cpe:2.3:o:qualcomm:wcn685x-1_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-1>>-
cpe:2.3:h:qualcomm:wcn685x-1:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>flight_rb5_5g_platform_firmware>>-
cpe:2.3:o:qualcomm:flight_rb5_5g_platform_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>flight_rb5_5g_platform>>-
cpe:2.3:h:qualcomm:flight_rb5_5g_platform:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>home_hub_100_platform_firmware>>-
cpe:2.3:o:qualcomm:home_hub_100_platform_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>home_hub_100_platform>>-
cpe:2.3:h:qualcomm:home_hub_100_platform:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9250_firmware>>-
cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9250>>-
cpe:2.3:h:qualcomm:mdm9250:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9628_firmware>>-
cpe:2.3:o:qualcomm:mdm9628_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9628>>-
cpe:2.3:h:qualcomm:mdm9628:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9650_firmware>>-
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>mdm9650>>-
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8108_firmware>>-
cpe:2.3:o:qualcomm:msm8108_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8108>>-
cpe:2.3:h:qualcomm:msm8108:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8209_firmware>>-
cpe:2.3:o:qualcomm:msm8209_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8209>>-
cpe:2.3:h:qualcomm:msm8209:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8608_firmware>>-
cpe:2.3:o:qualcomm:msm8608_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8608>>-
cpe:2.3:h:qualcomm:msm8608:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8909w_firmware>>-
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>msm8909w>>-
cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6174_firmware>>-
cpe:2.3:o:qualcomm:qca6174_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6174>>-
cpe:2.3:h:qualcomm:qca6174:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6174a_firmware>>-
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6174a>>-
cpe:2.3:h:qualcomm:qca6174a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6310_firmware>>-
cpe:2.3:o:qualcomm:qca6310_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6310>>-
cpe:2.3:h:qualcomm:qca6310:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6320_firmware>>-
cpe:2.3:o:qualcomm:qca6320_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6320>>-
cpe:2.3:h:qualcomm:qca6320:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6335_firmware>>-
cpe:2.3:o:qualcomm:qca6335_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6335>>-
cpe:2.3:h:qualcomm:qca6335:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391_firmware>>-
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391>>-
cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6420_firmware>>-
cpe:2.3:o:qualcomm:qca6420_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6420>>-
cpe:2.3:h:qualcomm:qca6420:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6421_firmware>>-
cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6421>>-
cpe:2.3:h:qualcomm:qca6421:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6426_firmware>>-
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6426>>-
cpe:2.3:h:qualcomm:qca6426:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6430_firmware>>-
cpe:2.3:o:qualcomm:qca6430_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6430>>-
cpe:2.3:h:qualcomm:qca6430:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6431_firmware>>-
cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6431>>-
cpe:2.3:h:qualcomm:qca6431:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6436_firmware>>-
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6436>>-
cpe:2.3:h:qualcomm:qca6436:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-401Primarynvd@nist.gov
CWE-401Secondaryproduct-security@qualcomm.com
CWE ID: CWE-401
Type: Primary
Source: nvd@nist.gov
CWE ID: CWE-401
Type: Secondary
Source: product-security@qualcomm.com
Evaluator Description

Evaluator Impact

Evaluator Solution

Vendor Statements

References
HyperlinkSourceResource
http://packetstormsecurity.com/files/172664/Qualcomm-Adreno-KGSL-Data-Leakage.htmlproduct-security@qualcomm.com
N/A
https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletinproduct-security@qualcomm.com
Patch
Vendor Advisory
Hyperlink: http://packetstormsecurity.com/files/172664/Qualcomm-Adreno-KGSL-Data-Leakage.html
Source: product-security@qualcomm.com
Resource: N/A
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
Source: product-security@qualcomm.com
Resource:
Patch
Vendor Advisory

Change History

0
Information is not available yet

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