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Vulnerability Details :

CVE-2023-33049

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-06 Feb, 2024 | 05:46
Updated At-17 Jun, 2025 | 21:29
Rejected At-
Credits

Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:06 Feb, 2024 | 05:46
Updated At:17 Jun, 2025 | 21:29
Rejected At:
▼CVE Numbering Authority (CNA)
Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon
Platforms
  • Snapdragon Auto
  • Snapdragon Compute
  • Snapdragon Consumer IOT
  • Snapdragon Industrial IOT
  • Snapdragon Mobile
Default Status
unaffected
Versions
Affected
  • 315 5G IoT Modem
  • AR8035
  • FastConnect 6200
  • FastConnect 6700
  • FastConnect 6800
  • FastConnect 6900
  • FastConnect 7800
  • QCA6174A
  • QCA6391
  • QCA6421
  • QCA6426
  • QCA6431
  • QCA6436
  • QCA6574A
  • QCA6584AU
  • QCA6595AU
  • QCA6696
  • QCA6698AQ
  • QCA8081
  • QCA8337
  • QCC710
  • QCM4490
  • QCM6490
  • QCM8550
  • QCN6024
  • QCN6224
  • QCN6274
  • QCN9024
  • QCS4490
  • QCS6490
  • QCS8550
  • QEP8111
  • QFW7114
  • QFW7124
  • Qualcomm Video Collaboration VC3 Platform
  • SD855
  • SD865 5G
  • SD888
  • SDX55
  • SDX57M
  • SG8275P
  • SM7250P
  • SM7315
  • SM7325P
  • SM8550P
  • Snapdragon 4 Gen 1 Mobile Platform
  • Snapdragon 4 Gen 2 Mobile Platform
  • Snapdragon 480 5G Mobile Platform
  • Snapdragon 480+ 5G Mobile Platform (SM4350-AC)
  • Snapdragon 690 5G Mobile Platform
  • Snapdragon 695 5G Mobile Platform
  • Snapdragon 750G 5G Mobile Platform
  • Snapdragon 765 5G Mobile Platform (SM7250-AA)
  • Snapdragon 765G 5G Mobile Platform (SM7250-AB)
  • Snapdragon 768G 5G Mobile Platform (SM7250-AC)
  • Snapdragon 778G 5G Mobile Platform
  • Snapdragon 778G+ 5G Mobile Platform (SM7325-AE)
  • Snapdragon 780G 5G Mobile Platform
  • Snapdragon 782G Mobile Platform (SM7325-AF)
  • Snapdragon 7c+ Gen 3 Compute
  • Snapdragon 8 Gen 1 Mobile Platform
  • Snapdragon 8 Gen 2 Mobile Platform
  • Snapdragon 8 Gen 3 Mobile Platform
  • Snapdragon 8+ Gen 1 Mobile Platform
  • Snapdragon 8+ Gen 2 Mobile Platform
  • Snapdragon 855 Mobile Platform
  • Snapdragon 855+/860 Mobile Platform (SM8150-AC)
  • Snapdragon 865 5G Mobile Platform
  • Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
  • Snapdragon 870 5G Mobile Platform (SM8250-AC)
  • Snapdragon 888 5G Mobile Platform
  • Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
  • Snapdragon Auto 5G Modem-RF
  • Snapdragon Auto 5G Modem-RF Gen 2
  • Snapdragon X35 5G Modem-RF System
  • Snapdragon X55 5G Modem-RF System
  • Snapdragon X65 5G Modem-RF System
  • Snapdragon X70 Modem-RF System
  • Snapdragon X75 5G Modem-RF System
  • Snapdragon XR2 5G Platform
  • SXR2130
  • WCD9340
  • WCD9341
  • WCD9360
  • WCD9370
  • WCD9375
  • WCD9380
  • WCD9385
  • WCD9390
  • WCD9395
  • WCN3950
  • WCN3988
  • WCN6740
  • WSA8810
  • WSA8815
  • WSA8830
  • WSA8832
  • WSA8835
  • WSA8840
  • WSA8845
  • WSA8845H
Problem Types
TypeCWE IDDescription
CWECWE-401CWE-401 Improper Release of Memory Before Removing Last Reference ('Memory Leak')
Type: CWE
CWE ID: CWE-401
Description: CWE-401 Improper Release of Memory Before Removing Last Reference ('Memory Leak')
Metrics
VersionBase scoreBase severityVector
3.17.5HIGH
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Version: 3.1
Base score: 7.5
Base severity: HIGH
Vector:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
N/A
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
Resource: N/A
▼Authorized Data Publishers (ADP)
1. CVE Program Container
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
x_transferred
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
Resource:
x_transferred
2. CISA ADP Vulnrichment
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:06 Feb, 2024 | 06:15
Updated At:11 Aug, 2025 | 15:06

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Primary3.17.5HIGH
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Type: Primary
Version: 3.1
Base score: 7.5
Base severity: HIGH
Vector:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
CPE Matches
Qualcomm Technologies, Inc.
qualcomm
>>315_5g_iot_modem_firmware>>-
cpe:2.3:o:qualcomm:315_5g_iot_modem_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>315_5g_iot_modem>>-
cpe:2.3:h:qualcomm:315_5g_iot_modem:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8035_firmware>>-
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8035>>-
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6200_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6200>>-
cpe:2.3:h:qualcomm:fastconnect_6200:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6700_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6700>>-
cpe:2.3:h:qualcomm:fastconnect_6700:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6800_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6800>>-
cpe:2.3:h:qualcomm:fastconnect_6800:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6900_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6900>>-
cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_7800_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_7800>>-
cpe:2.3:h:qualcomm:fastconnect_7800:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6174a_firmware>>-
cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6174a>>-
cpe:2.3:h:qualcomm:qca6174a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391_firmware>>-
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391>>-
cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6421_firmware>>-
cpe:2.3:o:qualcomm:qca6421_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6421>>-
cpe:2.3:h:qualcomm:qca6421:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6426_firmware>>-
cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6426>>-
cpe:2.3:h:qualcomm:qca6426:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6431_firmware>>-
cpe:2.3:o:qualcomm:qca6431_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6431>>-
cpe:2.3:h:qualcomm:qca6431:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6436_firmware>>-
cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6436>>-
cpe:2.3:h:qualcomm:qca6436:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6574a_firmware>>-
cpe:2.3:o:qualcomm:qca6574a_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6574a>>-
cpe:2.3:h:qualcomm:qca6574a:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6584au_firmware>>-
cpe:2.3:o:qualcomm:qca6584au_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6584au>>-
cpe:2.3:h:qualcomm:qca6584au:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6595au_firmware>>-
cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6595au>>-
cpe:2.3:h:qualcomm:qca6595au:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6696_firmware>>-
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6696>>-
cpe:2.3:h:qualcomm:qca6696:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6698aq_firmware>>-
cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6698aq>>-
cpe:2.3:h:qualcomm:qca6698aq:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8081_firmware>>-
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8081>>-
cpe:2.3:h:qualcomm:qca8081:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8337_firmware>>-
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8337>>-
cpe:2.3:h:qualcomm:qca8337:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcc710_firmware>>-
cpe:2.3:o:qualcomm:qcc710_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcc710>>-
cpe:2.3:h:qualcomm:qcc710:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm4490_firmware>>-
cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm4490>>-
cpe:2.3:h:qualcomm:qcm4490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm6490_firmware>>-
cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm6490>>-
cpe:2.3:h:qualcomm:qcm6490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm8550_firmware>>-
cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm8550>>-
cpe:2.3:h:qualcomm:qcm8550:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn6024_firmware>>-
cpe:2.3:o:qualcomm:qcn6024_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn6024>>-
cpe:2.3:h:qualcomm:qcn6024:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-401Secondaryproduct-security@qualcomm.com
CWE-401Primarynvd@nist.gov
CWE ID: CWE-401
Type: Secondary
Source: product-security@qualcomm.com
CWE ID: CWE-401
Type: Primary
Source: nvd@nist.gov
Evaluator Description
Evaluator Impact

Evaluator Solution

Vendor Statements
References
HyperlinkSourceResource
https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletinproduct-security@qualcomm.com
Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletinaf854a3a-2127-422b-91ae-364da2661108
Vendor Advisory
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
Source: product-security@qualcomm.com
Resource:
Vendor Advisory
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
Source: af854a3a-2127-422b-91ae-364da2661108
Resource:
Vendor Advisory

Change History

0
Information is not available yet

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