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Vulnerability Details :

CVE-2025-27052

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-08 Jul, 2025 | 12:49
Updated At-08 Jul, 2025 | 13:16
Rejected At-
Credits

Buffer Copy Without Checking Size of Input in Core Services

Memory corruption while processing data packets in diag received from Unix clients.

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:08 Jul, 2025 | 12:49
Updated At:08 Jul, 2025 | 13:16
Rejected At:
▼CVE Numbering Authority (CNA)
Buffer Copy Without Checking Size of Input in Core Services

Memory corruption while processing data packets in diag received from Unix clients.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon
Platforms
  • Snapdragon Auto
  • Snapdragon CCW
  • Snapdragon Compute
  • Snapdragon Consumer IOT
  • Snapdragon Industrial IOT
  • Snapdragon Mobile
  • Snapdragon WBC
  • Snapdragon Wearables
Default Status
unaffected
Versions
Affected
  • AR8035
  • FastConnect 6200
  • FastConnect 6700
  • FastConnect 6900
  • FastConnect 7800
  • Flight RB5 5G Platform
  • MDM9628
  • QAM8255P
  • QAM8295P
  • QAM8620P
  • QAM8650P
  • QAM8775P
  • QAMSRV1H
  • QAMSRV1M
  • QCA6174A
  • QCA6391
  • QCA6564A
  • QCA6564AU
  • QCA6574
  • QCA6574A
  • QCA6574AU
  • QCA6584AU
  • QCA6595
  • QCA6595AU
  • QCA6678AQ
  • QCA6688AQ
  • QCA6696
  • QCA6698AQ
  • QCA6698AU
  • QCA6797AQ
  • QCA8081
  • QCA8337
  • QCA9367
  • QCA9377
  • QCC710
  • QCM2290
  • QCM4325
  • QCM5430
  • QCM6125
  • QCM6490
  • QCM8550
  • QCN6224
  • QCN6274
  • QCN9011
  • QCN9012
  • QCN9274
  • QCS2290
  • QCS5430
  • QCS6125
  • QCS615
  • QCS6490
  • QCS7230
  • QCS8250
  • QCS8300
  • QCS8550
  • QCS9100
  • QEP8111
  • QFW7114
  • QFW7124
  • QMP1000
  • QRB5165N
  • Qualcomm Video Collaboration VC1 Platform
  • Qualcomm Video Collaboration VC3 Platform
  • Qualcomm Video Collaboration VC5 Platform
  • Robotics RB5 Platform
  • SA4150P
  • SA4155P
  • SA6155P
  • SA7255P
  • SA7775P
  • SA8155P
  • SA8195P
  • SA8255P
  • SA8295P
  • SA8620P
  • SA8650P
  • SA8770P
  • SA8775P
  • SA9000P
  • SG4150P
  • SG8275P
  • SM4635
  • SM6650
  • SM6650P
  • SM7635
  • SM7635P
  • SM7675
  • SM7675P
  • SM8550P
  • SM8635
  • SM8635P
  • SM8650Q
  • SM8735
  • SM8750
  • SM8750P
  • Snapdragon 4 Gen 1 Mobile Platform
  • Snapdragon 460 Mobile Platform
  • Snapdragon 480 5G Mobile Platform
  • Snapdragon 480+ 5G Mobile Platform (SM4350-AC)
  • Snapdragon 662 Mobile Platform
  • Snapdragon 680 4G Mobile Platform
  • Snapdragon 685 4G Mobile Platform (SM6225-AD)
  • Snapdragon 695 5G Mobile Platform
  • Snapdragon 8 Gen 1 Mobile Platform
  • Snapdragon 8 Gen 2 Mobile Platform
  • Snapdragon 8 Gen 3 Mobile Platform
  • Snapdragon 8+ Gen 2 Mobile Platform
  • Snapdragon AR1 Gen 1 Platform
  • Snapdragon AR1 Gen 1 Platform "Luna1"
  • Snapdragon Auto 5G Modem-RF Gen 2
  • Snapdragon W5+ Gen 1 Wearable Platform
  • Snapdragon X32 5G Modem-RF System
  • Snapdragon X35 5G Modem-RF System
  • Snapdragon X72 5G Modem-RF System
  • Snapdragon X75 5G Modem-RF System
  • SRV1H
  • SRV1L
  • SRV1M
  • SW5100
  • SW5100P
  • SXR2230P
  • SXR2250P
  • SXR2330P
  • Vision Intelligence 400 Platform
  • WCD9335
  • WCD9340
  • WCD9341
  • WCD9370
  • WCD9375
  • WCD9378
  • WCD9380
  • WCD9385
  • WCD9390
  • WCD9395
  • WCN3660B
  • WCN3680B
  • WCN3910
  • WCN3950
  • WCN3980
  • WCN3988
  • WCN3990
  • WCN6450
  • WCN6650
  • WCN6755
  • WCN7750
  • WCN7860
  • WCN7861
  • WCN7880
  • WCN7881
  • WSA8810
  • WSA8815
  • WSA8830
  • WSA8832
  • WSA8835
  • WSA8840
  • WSA8845
  • WSA8845H
Problem Types
TypeCWE IDDescription
CWECWE-120CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Type: CWE
CWE ID: CWE-120
Description: CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')
Metrics
VersionBase scoreBase severityVector
3.17.8HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Version: 3.1
Base score: 7.8
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
N/A
Hyperlink: https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
Resource: N/A
▼Authorized Data Publishers (ADP)
CISA ADP Vulnrichment
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:08 Jul, 2025 | 13:15
Updated At:11 Aug, 2025 | 15:06

Memory corruption while processing data packets in diag received from Unix clients.

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Primary3.17.8HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Type: Primary
Version: 3.1
Base score: 7.8
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
CPE Matches
Qualcomm Technologies, Inc.
qualcomm
>>ar8035_firmware>>-
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8035>>-
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6200_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6200_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6200>>-
cpe:2.3:h:qualcomm:fastconnect_6200:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6700_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6700>>-
cpe:2.3:h:qualcomm:fastconnect_6700:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6900_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6900>>-
cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_7800_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_7800>>-
cpe:2.3:h:qualcomm:fastconnect_7800:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7635p_firmware>>-
cpe:2.3:o:qualcomm:sm7635p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7635p>>-
cpe:2.3:h:qualcomm:sm7635p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7675_firmware>>-
cpe:2.3:o:qualcomm:sm7675_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7675>>-
cpe:2.3:h:qualcomm:sm7675:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7675p_firmware>>-
cpe:2.3:o:qualcomm:sm7675p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7675p>>-
cpe:2.3:h:qualcomm:sm7675p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8550p_firmware>>-
cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8550p>>-
cpe:2.3:h:qualcomm:sm8550p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8635_firmware>>-
cpe:2.3:o:qualcomm:sm8635_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8635>>-
cpe:2.3:h:qualcomm:sm8635:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8635p_firmware>>-
cpe:2.3:o:qualcomm:sm8635p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8635p>>-
cpe:2.3:h:qualcomm:sm8635p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8650q_firmware>>-
cpe:2.3:o:qualcomm:sm8650q_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8650q>>-
cpe:2.3:h:qualcomm:sm8650q:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8735_firmware>>-
cpe:2.3:o:qualcomm:sm8735_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8735>>-
cpe:2.3:h:qualcomm:sm8735:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8750_firmware>>-
cpe:2.3:o:qualcomm:sm8750_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8750>>-
cpe:2.3:h:qualcomm:sm8750:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8750p_firmware>>-
cpe:2.3:o:qualcomm:sm8750p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8750p>>-
cpe:2.3:h:qualcomm:sm8750p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_4_gen_1_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_4_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_4_gen_1_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_4_gen_1_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_460_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_460_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_460_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_460_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_480_5g_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_480_5g_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_480_5g_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_480_5g_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_480\+_5g_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_480\+_5g_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_480\+_5g_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_480\+_5g_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_662_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_662_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_662_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_662_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_680_4g_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_680_4g_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_680_4g_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_680_4g_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_685_4g_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_685_4g_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_685_4g_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_685_4g_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_695_5g_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_695_5g_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_695_5g_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_695_5g_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_1_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_1_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_8_gen_1_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_2_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_2_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_8_gen_2_mobile:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-120Primaryproduct-security@qualcomm.com
CWE ID: CWE-120
Type: Primary
Source: product-security@qualcomm.com
Evaluator Description
Evaluator Impact

Evaluator Solution

Vendor Statements
References
HyperlinkSourceResource
https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.htmlproduct-security@qualcomm.com
Vendor Advisory
Hyperlink: https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
Source: product-security@qualcomm.com
Resource:
Vendor Advisory

Change History

0
Information is not available yet

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