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CVE Vulnerability Details :
CVE-2022-33269
PUBLISHED
More InfoOfficial Page
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
View Known Exploited Vulnerability (KEV) details
Published At-04 Apr, 2023 | 04:46
Updated At-03 Aug, 2024 | 08:01
Rejected At-
▼CVE Numbering Authority (CNA)
Integer overflow or wraparound in Core

Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon
Platforms
  • Snapdragon Auto
  • Snapdragon Compute
  • Snapdragon Consumer IOT
  • Snapdragon Mobile
Default Status
unaffected
Versions
Affected
  • AQT1000
  • AR8035
  • FastConnect 6200
  • FastConnect 6800
  • FastConnect 6900
  • FastConnect 7800
  • QAM8295P
  • QCA6174A
  • QCA6310
  • QCA6335
  • QCA6391
  • QCA6420
  • QCA6421
  • QCA6426
  • QCA6430
  • QCA6431
  • QCA6436
  • QCA6564A
  • QCA6564AU
  • QCA6574
  • QCA6574A
  • QCA6574AU
  • QCA6595
  • QCA6595AU
  • QCA6696
  • QCA6698AQ
  • QCA8081
  • QCA8337
  • QCA9377
  • QCN6024
  • QCN9024
  • QSM8350
  • Qualcomm Robotics RB3 Platform
  • SA6145P
  • SA6155
  • SA6155P
  • SA8150P
  • SA8155
  • SA8155P
  • SA8295P
  • SA8540P
  • SA9000P
  • SD 675
  • SD 8 Gen1 5G
  • SD 8CX
  • SD 8cx Gen2
  • SD 8cx Gen3
  • SD670
  • SD675
  • SD855
  • SD865 5G
  • SDX55
  • SDX57M
  • SM7250P
  • Snapdragon 670 Mobile Platform
  • Snapdragon 675 Mobile Platform
  • Snapdragon 678 Mobile Platform (SM6150-AC)
  • Snapdragon 765 5G Mobile Platform (SM7250-AA)
  • Snapdragon 765G 5G Mobile Platform (SM7250-AB)
  • Snapdragon 768G 5G Mobile Platform (SM7250-AC)
  • Snapdragon 8 Gen 1 Mobile Platform
  • Snapdragon 845 Mobile Platform
  • Snapdragon 850 Mobile Compute Platform
  • Snapdragon 855 Mobile Platform
  • Snapdragon 855+/860 Mobile Platform (SM8150-AC)
  • Snapdragon 865 5G Mobile Platform
  • Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
  • Snapdragon 870 5G Mobile Platform (SM8250-AC)
  • Snapdragon 888 5G Mobile Platform
  • Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
  • Snapdragon AR2 Gen 1 Platform
  • Snapdragon X24 LTE Modem
  • Snapdragon X50 5G Modem-RF System
  • Snapdragon X55 5G Modem-RF System
  • Snapdragon X65 5G Modem-RF System
  • Snapdragon X70 Modem-RF System
  • Snapdragon XR2 5G Platform
  • SSG2115P
  • SSG2125P
  • SXR1230P
  • SXR2130
  • SXR2230P
  • Vision Intelligence 300 Platform
  • Vision Intelligence 400 Platform
  • WCD9326
  • WCD9340
  • WCD9341
  • WCD9370
  • WCD9375
  • WCD9380
  • WCD9385
  • WCN3950
  • WCN3980
  • WCN3990
  • WSA8810
  • WSA8815
  • WSA8830
  • WSA8832
  • WSA8835
Problem Types
TypeCWE IDDescription
CWECWE-190CWE-190 Integer Overflow or Wraparound
Type: CWE
CWE ID: CWE-190
Description: CWE-190 Integer Overflow or Wraparound
Metrics
VersionBase scoreBase severityVector
3.19.3CRITICAL
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Version: 3.1
Base score: 9.3
Base severity: CRITICAL
Vector:
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
N/A
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
Resource: N/A
▼Authorized Data Publishers (ADP)
CVE Program Container
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
x_transferred
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
Resource:
x_transferred
Details not found