Memory corruption in Graphics Driver when destroying a context with KGSL_GPU_AUX_COMMAND_TIMELINE objects queued.
Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
Memory corruption while running VK synchronization with KASAN enabled.
Memory corruption in DSP Service during a remote call from HLOS to DSP.
Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
Memory corruption in Graphics while processing user packets for command submission.
When sending a socket event message to a user application, invalid information will be passed if socket is freed by other thread resulting in a Use After Free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Memory corruption while handling IOCTL call from user-space to set latency level.
Memory corruption during concurrent access to server info object due to incorrect reference count update.
Memory corruption in graphic driver due to use after free while calling multiple threads application to driver. in Snapdragon Consumer IOT
Memory corruption during concurrent SSR execution due to race condition on the global maps list.
kernel event may contain unexpected content which is not generated by NPU software in asynchronous execution mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in synx driver due to use-after-free condition in the synx driver due to accessing object handles without acquiring lock in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Memory Corruption in Audio while invoking IOCTLs calls from the user-space.
Use after free issue occurs If another instance of open for voice_svc node has been called from application without closing the previous one. in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
Use after free issue in cleanup routine due to missing pointer sanitization for a failed start of a trusted application. in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130
Memory Corruption in camera while installing a fd for a particular DMA buffer.
Memory corruption during voice activation, when sound model parameters are loaded from HLOS, and the received sound model list is empty in HLOS drive.
Memory corruption while handling file descriptor during listener registration/de-registration.
Memory corruption while processing command in Glink linux.
Memory corruption during GNSS HAL process initialization.
Memory corruption while invoking IOCTL calls from user-space to kernel-space to handle session errors.
Memory corruption while registering a buffer from user-space to kernel-space using IOCTL calls.
Memory corruption while processing IOCTL call for getting group info.
Memory corruption while processing user packets to generate page faults.
Memory corruption while processing concurrent IOCTL calls.
A use after free vulnerability in perf-mgr driver prior to SMR Oct-2022 Release 1 allows attacker to cause memory access fault.
Memory corruption due to use after free in Modem while modem initialization.
Memory corruption due to use after free in Core when multiple DCI clients register and deregister.
Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.
Memory Corruption while deallocating graphics processing unit memory buffers due to improper handling of memory pointers.
Memory corruption in graphics due to use-after-free while importing graphics buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in multimedia due to use after free during callback registration failure in Snapdragon Mobile
Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events.
Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released.
Memory corruption while processing IOCTL calls to unmap the buffers.
Memory corruption can occur when process-specific maps are added to the global list. If a map is removed from the global list while another thread is using it for a process-specific task, issues may arise.
Memory corruption while handling multiple IOCTL calls from userspace to operate DMA operations.
Memory corruption while encoding JPEG format.
Memory corruption while handling multuple IOCTL calls from userspace for remote invocation.
Memory corruption during concurrent access to server info object due to unprotected critical field.
Memory corruption during video playback when video session open fails with time out error.
memory corruption while processing IOCTL commands, when the buffer in write loopback mode is accessed after being freed.
Memory corruption while processing the TESTPATTERNCONFIG escape path.
Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Memory corruption while processing a private escape command in an event trigger.
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.
Memory corruption while processing memory map or unmap IOCTL operations simultaneously.
Memory corruption when IOCTL interface is called to map and unmap buffers simultaneously.