Logo
-

Byte Open Security

(ByteOS Network)

Log In

Sign Up

ByteOS

Security
Vulnerability Details
Registries
Custom Views
Weaknesses
Attack Patterns
Filters & Tools
Vulnerability Details :

CVE-2023-33043

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-05 Dec, 2023 | 03:04
Updated At-02 Aug, 2024 | 15:32
Rejected At-
Credits

Reachable Assertion in Modem

Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:05 Dec, 2023 | 03:04
Updated At:02 Aug, 2024 | 15:32
Rejected At:
▼CVE Numbering Authority (CNA)
Reachable Assertion in Modem

Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon
Platforms
  • Snapdragon Auto
  • Snapdragon Compute
  • Snapdragon Consumer IOT
  • Snapdragon Industrial IOT
  • Snapdragon Mobile
Default Status
unaffected
Versions
Affected
  • AR8035
  • FastConnect 6200
  • FastConnect 6700
  • FastConnect 6900
  • FastConnect 7800
  • QCA6391
  • QCA8081
  • QCA8337
  • QCM4490
  • QCM6490
  • QCM8550
  • QCN6024
  • QCN9024
  • QCS4490
  • QCS6490
  • QCS8550
  • Qualcomm Video Collaboration VC3 Platform
  • SD888
  • SDX57M
  • SM7315
  • SM7325P
  • SM8550P
  • Snapdragon 4 Gen 1 Mobile Platform
  • Snapdragon 4 Gen 2 Mobile Platform
  • Snapdragon 480 5G Mobile Platform
  • Snapdragon 480+ 5G Mobile Platform (SM4350-AC)
  • Snapdragon 695 5G Mobile Platform
  • Snapdragon 778G 5G Mobile Platform
  • Snapdragon 778G+ 5G Mobile Platform (SM7325-AE)
  • Snapdragon 780G 5G Mobile Platform
  • Snapdragon 782G Mobile Platform (SM7325-AF)
  • Snapdragon 7c+ Gen 3 Compute
  • Snapdragon 8 Gen 1 Mobile Platform
  • Snapdragon 8 Gen 2 Mobile Platform
  • Snapdragon 8+ Gen 1 Mobile Platform
  • Snapdragon 8+ Gen 2 Mobile Platform
  • Snapdragon 888 5G Mobile Platform
  • Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
  • Snapdragon X65 5G Modem-RF System
  • Snapdragon X70 Modem-RF System
  • WCD9370
  • WCD9375
  • WCD9380
  • WCD9385
  • WCD9390
  • WCD9395
  • WCN3950
  • WCN3988
  • WCN6740
  • WSA8810
  • WSA8815
  • WSA8830
  • WSA8832
  • WSA8835
  • WSA8840
  • WSA8845
  • WSA8845H
Problem Types
TypeCWE IDDescription
CWECWE-617CWE-617 Reachable Assertion
Type: CWE
CWE ID: CWE-617
Description: CWE-617 Reachable Assertion
Metrics
VersionBase scoreBase severityVector
3.17.5HIGH
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Version: 3.1
Base score: 7.5
Base severity: HIGH
Vector:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
N/A
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
Resource: N/A
▼Authorized Data Publishers (ADP)
CVE Program Container
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions

Configurations

Workarounds

Exploits

Credits

Timeline
EventDate
Replaced By

Rejected Reason

References
HyperlinkResource
https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
x_transferred
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
Resource:
x_transferred
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:05 Dec, 2023 | 03:15
Updated At:11 Aug, 2025 | 15:06

Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Secondary3.17.5HIGH
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Primary3.17.5HIGH
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Type: Secondary
Version: 3.1
Base score: 7.5
Base severity: HIGH
Vector:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Type: Primary
Version: 3.1
Base score: 7.5
Base severity: HIGH
Vector:
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
CPE Matches

Qualcomm Technologies, Inc.
qualcomm
>>ar8035_firmware>>-
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ar8035>>-
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn3991_firmware>>-
cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn3991>>-
cpe:2.3:h:qualcomm:wcn3991:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn3998_firmware>>-
cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn3998>>-
cpe:2.3:h:qualcomm:wcn3998:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn6750_firmware>>-
cpe:2.3:o:qualcomm:wcn6750_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn6750>>-
cpe:2.3:h:qualcomm:wcn6750:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-5_firmware>>-
cpe:2.3:o:qualcomm:wcn685x-5_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-5>>-
cpe:2.3:h:qualcomm:wcn685x-5:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-1_firmware>>-
cpe:2.3:o:qualcomm:wcn685x-1_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn685x-1>>-
cpe:2.3:h:qualcomm:wcn685x-1:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn785x-1_firmware>>-
cpe:2.3:o:qualcomm:wcn785x-1_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn785x-1>>-
cpe:2.3:h:qualcomm:wcn785x-1:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn785x-5_firmware>>-
cpe:2.3:o:qualcomm:wcn785x-5_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>wcn785x-5>>-
cpe:2.3:h:qualcomm:wcn785x-5:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391_firmware>>-
cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6391>>-
cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8081_firmware>>-
cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8081>>-
cpe:2.3:h:qualcomm:qca8081:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8337_firmware>>-
cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca8337>>-
cpe:2.3:h:qualcomm:qca8337:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm4490_firmware>>-
cpe:2.3:o:qualcomm:qcm4490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm4490>>-
cpe:2.3:h:qualcomm:qcm4490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm6490_firmware>>-
cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm6490>>-
cpe:2.3:h:qualcomm:qcm6490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm8550_firmware>>-
cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm8550>>-
cpe:2.3:h:qualcomm:qcm8550:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn6024_firmware>>-
cpe:2.3:o:qualcomm:qcn6024_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn6024>>-
cpe:2.3:h:qualcomm:qcn6024:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn9024_firmware>>-
cpe:2.3:o:qualcomm:qcn9024_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcn9024>>-
cpe:2.3:h:qualcomm:qcn9024:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs4490_firmware>>-
cpe:2.3:o:qualcomm:qcs4490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs4490>>-
cpe:2.3:h:qualcomm:qcs4490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs6490_firmware>>-
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs6490>>-
cpe:2.3:h:qualcomm:qcs6490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs8550_firmware>>-
cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs8550>>-
cpe:2.3:h:qualcomm:qcs8550:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>video_collaboration_vc3_platform_firmware>>-
cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>video_collaboration_vc3_platform>>-
cpe:2.3:h:qualcomm:video_collaboration_vc3_platform:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd888_firmware>>-
cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd888>>-
cpe:2.3:h:qualcomm:sd888:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sdx57m_firmware>>-
cpe:2.3:o:qualcomm:sdx57m_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sdx57m>>-
cpe:2.3:h:qualcomm:sdx57m:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7315_firmware>>-
cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7315>>-
cpe:2.3:h:qualcomm:sm7315:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7325p_firmware>>-
cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm7325p>>-
cpe:2.3:h:qualcomm:sm7325p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8550p_firmware>>-
cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8550p>>-
cpe:2.3:h:qualcomm:sm8550p:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-617Secondaryproduct-security@qualcomm.com
CWE-617Primarynvd@nist.gov
CWE ID: CWE-617
Type: Secondary
Source: product-security@qualcomm.com
CWE ID: CWE-617
Type: Primary
Source: nvd@nist.gov
Evaluator Description

Evaluator Impact

Evaluator Solution

Vendor Statements

References
HyperlinkSourceResource
https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletinproduct-security@qualcomm.com
Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletinaf854a3a-2127-422b-91ae-364da2661108
Vendor Advisory
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
Source: product-security@qualcomm.com
Resource:
Vendor Advisory
Hyperlink: https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
Source: af854a3a-2127-422b-91ae-364da2661108
Resource:
Vendor Advisory

Change History

0
Information is not available yet

Similar CVEs

0Records found

Details not found