Memory corruption when keymaster operation imports a shared key.
Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.
Memory corruption when size of buffer from previous call is used without validation or re-initialization.
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
Memory corruption when the payload received from firmware is not as per the expected protocol size.
Memory corruption when the channel ID passed by user is not validated and further used.
Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.
Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible stack overflow due to improper validation of camera name length before copying the name in VR Service in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT
Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Improper validation of buffer size input to the EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Memory corruption while processing IOCTL handler in FastRPC.
Memory corruption while processing TPC target power table in FTM TPC.
Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while executing timestamp video decode command with large input values.
Memory corruption may occur while reading board data via IOCTL call when the WLAN driver copies the content to the provided output buffer.
Memory corruption when programming registers through virtual CDM.
Memory corruption while processing a message, when the buffer is controlled by a Guest VM, the value can be changed continuously.
Memory corruption while processing image encoding, when configuration is NULL in IOCTL parameter.
Memory corruption due to improper input validation while processing IO control which is nonstandard in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Wired Infrastructure and Networking
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.
Memory corruption while reading the FW response from the shared queue.
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.
Memory corruption while processing image encoding, when input buffer length is 0 in IOCTL call.
Memory corruption while processing an IOCTL request, when buffer significantly exceeds the command argument limit.
Possible memory corruption due to lack of bound check of input index in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Improper length check of public exponent in RSA import key function could cause memory corruption. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.
Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Possible buffer overflow due to improper validation of FTM command payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Memory corruption while receiving a message in Bus Socket Transport Server.
Memory corruption in Core due to stack-based buffer overflow.
Memory corruption in core due to stack-based buffer overflow
Memory corruption in Audio when SSR event is triggered after music playback is stopped.
Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND.
Memory corruption in Audio while processing the VOC packet data from ADSP.
The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.
Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
Memory corruption in Core when updating rollback version for TA and OTA feature is enabled.
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
Memory corruption due to stack based buffer overflow in core while sending command from USB of large size.
Memory corruption in Audio due to use of out-of-range pointer offset while Initiating a voice call session from user space with invalid session id.
Memory corruption due to configuration weakness in modem wile sending command to write protected files.
Memory corruption in Automotive Android OS due to improper input validation.
Memory corruption in Linux while sending DRM request.
Memory corruption in Automotive due to improper input validation.