ByteOS Network

Vulnerability Details :

CVE-2025-21455

Summary

Assigner-qualcomm

Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f

Published At-06 Aug, 2025 | 07:25

Updated At-07 Aug, 2025 | 03:55

Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux

Memory corruption while submitting blob data to kernel space though IOCTL.

EPSS History

Score

Latest Score

N/A

Percentile

Latest Percentile

N/A

▼Common Vulnerabilities and Exposures (CVE)

cve.org

Assigner:qualcomm

Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f

Published At:06 Aug, 2025 | 07:25

Updated At:07 Aug, 2025 | 03:55

▼CVE Numbering Authority (CNA)

Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux

Memory corruption while submitting blob data to kernel space though IOCTL.

Affected Products

Vendor

Qualcomm Technologies, Inc.

Product

Snapdragon

Platforms

Snapdragon Compute
Snapdragon Mobile
Snapdragon Wearables

Default Status

unaffected

Versions

Affected

FastConnect 6800
FastConnect 6900
FastConnect 7800
QCA6391
QCA6426
QCA6436
QSM8250
SD865 5G
SDX55
Snapdragon 8 Gen 1 Mobile Platform
Snapdragon 865 5G Mobile Platform
Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
Snapdragon 870 5G Mobile Platform (SM8250-AC)
Snapdragon X55 5G Modem-RF System
Snapdragon XR2 5G Platform
SW5100
SW5100P
SXR2130
SXR2230P
SXR2250P
WCD9380
WCD9385
WCN3980
WCN3988
WSA8810
WSA8815
WSA8830
WSA8832
WSA8835

Problem Types

Type	CWE ID	Description
CWE	CWE-367	CWE-367 Time-of-check Time-of-use (TOCTOU) Race Condition

Type: CWE

CWE ID: CWE-367

Description: CWE-367 Time-of-check Time-of-use (TOCTOU) Race Condition

Metrics

Version	Base score	Base severity	Vector
3.1	7.8	HIGH	CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Version: 3.1

Base score: 7.8

Base severity: HIGH

Vector:

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

References

Hyperlink	Resource
https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html	N/A

Hyperlink: https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html

Resource: N/A

▼Authorized Data Publishers (ADP)

CISA ADP Vulnrichment

Metrics Other Info

▼National Vulnerability Database (NVD)

nvd.nist.gov

Source:product-security@qualcomm.com

Published At:06 Aug, 2025 | 08:15

Updated At:20 Aug, 2025 | 19:42

Memory corruption while submitting blob data to kernel space though IOCTL.

Date Added	Due Date	Vulnerability Name	Required Action
	N/A

Metrics

Type	Version	Base score	Base severity	Vector
Primary	3.1	7.8	HIGH	CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Type: Primary

Version: 3.1

Base score: 7.8

Base severity: HIGH

Vector:

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

CPE Matches

Qualcomm Technologies, Inc.

>>fastconnect_6800_firmware>>-

cpe:2.3:o:qualcomm:fastconnect_6800_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>fastconnect_6800>>-

cpe:2.3:h:qualcomm:fastconnect_6800:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>fastconnect_6900_firmware>>-

cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>fastconnect_6900>>-

cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>fastconnect_7800_firmware>>-

cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>fastconnect_7800>>-

cpe:2.3:h:qualcomm:fastconnect_7800:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qca6391_firmware>>-

cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qca6391>>-

cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qca6426_firmware>>-

cpe:2.3:o:qualcomm:qca6426_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qca6426>>-

cpe:2.3:h:qualcomm:qca6426:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qca6436_firmware>>-

cpe:2.3:o:qualcomm:qca6436_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qca6436>>-

cpe:2.3:h:qualcomm:qca6436:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qsm8250_firmware>>-

cpe:2.3:o:qualcomm:qsm8250_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>qsm8250>>-

cpe:2.3:h:qualcomm:qsm8250:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sd865_5g_firmware>>-

cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sd865_5g>>-

cpe:2.3:h:qualcomm:sd865_5g:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdx55_firmware>>-

cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sdx55>>-

cpe:2.3:h:qualcomm:sdx55:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_8_gen_1_mobile_platform_firmware>>-

cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_platform_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_8_gen_1_mobile_platform>>-

cpe:2.3:h:qualcomm:snapdragon_8_gen_1_mobile_platform:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_865_5g_mobile_platform_firmware>>-

cpe:2.3:o:qualcomm:snapdragon_865_5g_mobile_platform_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_865_5g_mobile_platform>>-

cpe:2.3:h:qualcomm:snapdragon_865_5g_mobile_platform:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\)_firmware>>-

cpe:2.3:o:qualcomm:snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\)_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\)>>-

cpe:2.3:h:qualcomm:snapdragon_865\+_5g_mobile_platform_\(sm8250-ab\):-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_870_5g_mobile_platform_\(sm8250-ac\)_firmware>>-

cpe:2.3:o:qualcomm:snapdragon_870_5g_mobile_platform_\(sm8250-ac\)_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_870_5g_mobile_platform_\(sm8250-ac\)>>-

cpe:2.3:h:qualcomm:snapdragon_870_5g_mobile_platform_\(sm8250-ac\):-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_x55_5g_modem-rf_system_firmware>>-

cpe:2.3:o:qualcomm:snapdragon_x55_5g_modem-rf_system_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_x55_5g_modem-rf_system>>-

cpe:2.3:h:qualcomm:snapdragon_x55_5g_modem-rf_system:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_xr2_5g_platform_firmware>>-

cpe:2.3:o:qualcomm:snapdragon_xr2_5g_platform_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>snapdragon_xr2_5g_platform>>-

cpe:2.3:h:qualcomm:snapdragon_xr2_5g_platform:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sw5100_firmware>>-

cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sw5100>>-

cpe:2.3:h:qualcomm:sw5100:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sw5100p_firmware>>-

cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sw5100p>>-

cpe:2.3:h:qualcomm:sw5100p:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2130_firmware>>-

cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2130>>-

cpe:2.3:h:qualcomm:sxr2130:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2230p_firmware>>-

cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2230p>>-

cpe:2.3:h:qualcomm:sxr2230p:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2250p_firmware>>-

cpe:2.3:o:qualcomm:sxr2250p_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>sxr2250p>>-

cpe:2.3:h:qualcomm:sxr2250p:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcd9380_firmware>>-

cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcd9380>>-

cpe:2.3:h:qualcomm:wcd9380:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcd9385_firmware>>-

cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcd9385>>-

cpe:2.3:h:qualcomm:wcd9385:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcn3980_firmware>>-

cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcn3980>>-

cpe:2.3:h:qualcomm:wcn3980:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcn3988_firmware>>-

cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wcn3988>>-

cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wsa8810_firmware>>-

cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*

Qualcomm Technologies, Inc.

>>wsa8810>>-

cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*

Weaknesses

CWE ID	Type	Source
CWE-367	Primary	product-security@qualcomm.com

CWE ID: CWE-367

Type: Primary

Source: product-security@qualcomm.com

References

Hyperlink	Source	Resource
https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html	product-security@qualcomm.com	Vendor Advisory

Hyperlink: https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html

Source: product-security@qualcomm.com

Resource:

Vendor Advisory

CVE-2025-21455

Credits

Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux

Vendors

Products

Metrics (CVSS)

Weaknesses

Attack Patterns

Solution/Workaround

References

EPSS History

Score

Latest Score

N/A

Percentile

Latest Percentile

N/A

Stakeholder-Specific Vulnerability Categorization (SSVC)

Affected Products

Affected

Problem Types

Metrics

Metrics Other Info

Impacts

Solutions

Configurations

Workarounds

Exploits

Credits

Timeline

Replaced By

Rejected Reason

References

Affected Products

Metrics

Metrics Other Info

Impacts

Solutions

Configurations

Workarounds

Exploits

Credits

Timeline

Replaced By

Rejected Reason

References

CISA Catalog

Metrics

CPE Matches

Weaknesses

Evaluator Description

Evaluator Impact

Evaluator Solution

Vendor Statements

References

Change History

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