Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
Memory corruption in SPI buses due to improper input validation while reading address configuration from spi buses in Snapdragon Mobile, Snapdragon Wearables
Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables
Memory corruption while performing encryption and decryption commands.
Memory corruption while processing TPC target power table in FTM TPC.
Memory corruption while processing IOCTL handler in FastRPC.
Memory corruption in audio due to lack of check of invalid routing address into APR Routing table in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in Core due to improper configuration in boot remapper.
Memory corruption when extracting qcp audio file due to lack of check on data length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Memory corruption in video due to buffer overflow while reading the dts file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation.
Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Memory corruption in multimedia due to improper check on received export descriptors in Snapdragon Auto
Out of bound issue in WLAN driver while processing vdev responses from firmware due to lack of validation of data received from firmware in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P
Memory corruption while invoking IOCTL calls from user space to set generic private command inside WLAN driver.
Memory corruption in SPS Application while requesting for public key in sorter TA.
Memory corruption in Core Services while executing the command for removing a single event listener.
Memory Corruption in Core Platform while printing the response buffer in log.
Memory corruption due to untrusted pointer dereference in automotive during system call.
Memory Corruption in HLOS while registering for key provisioning notify.
Memory Corruption in Audio while playing amrwbplus clips with modified content.
u'SMEM partition can be manipulated in case of any compromise on HLOS, thus resulting in access to memory outside of SMEM address range which could lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6574AU, QCA8081, QCM2150, QCN7605, QCN7606, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Possible buffer overwrite in message handler due to lack of validation of tid value calculated from packets received from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, APQ8064, APQ8096AU, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MDM9615, MDM9640, MDM9650, MSM8909, MSM8909W, MSM8939, MSM8996AU, QCA4531, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCA9558, QCA9880, QCA9886, QCA9980, SDA660, SDM630, SDM636, SDM660, SDX20, SDX24
Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while processing image encoding, when configuration is NULL in IOCTL parameter.
Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer.
Memory corruption may occur while reading board data via IOCTL call when the WLAN driver copies the content to the provided output buffer.
Memory corruption while handling different IOCTL calls from the user-space simultaneously.
Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.
Memory Corruption when accessing a buffer after it has been freed while processing IOCTL calls.
Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and deallocation of buffer resources.
Memory Corruption when accessing trusted execution environment without proper privilege check.
Memory Corruption while invoking IOCTL calls when concurrent access to shared buffer occurs.
Memory Corruption when adding user-supplied data without checking available buffer space.
Memory corruption while using alignments for memory allocation.
Memory corruption while processing camera TPG write request.
Memory corruption while transmitting packet mapping information with invalid header payload size.
Certain unprivileged processes are able to perform IOCTL calls.
Memory corruption while performing private key encryption in trusted application.
Memory corruption while processing INIT and multimode invoke IOCTL calls on FastRPC.
Memory corruption may occur due top improper access control in HAB process.
Memory corruption while IOCTL call is invoked from user-space to read board data.
Memory corruption when using Virtual cdm (Camera Data Mover) to write registers.
Memory corruption while processing memory map or unmap IOCTL operations simultaneously.