Forcing the Bluetooth LE stack to segment 'prepare write response' packets can lead to an out-of-bounds memory access.
Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames.
Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames.
Permanent DOS when DL NAS transport receives multiple payloads such that one payload contains SOR container whose integrity check has failed, and the other is LPP where UE needs to send status message to network.
Improper handling of ASB-C broadcast packets with crafted opcode in LMP can lead to uncontrolled resource consumption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Transient DOS in Bluetooth HOST while passing descriptor to validate the blacklisted BT keyboard.
Improper Access Control when ACL link encryption is failed and ACL link is not disconnected during reconnection with paired device in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
In all android releases(Android for MSM, Firefox OS for MSM, QRD Android) from CAF using the linux kernel, While processing the RIC Data Descriptor IE in an artificially crafted 802.11 frame with IE length more than 255, an infinite loop may potentially occur resulting in a denial of service.
Improper handling of ASB-U packet with L2CAP channel ID by slave host can lead to interference with piconet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
In a camera driver function in all Android releases from CAF using the Linux kernel, a bounds check is missing when writing into an array potentially leading to an out-of-bounds heap write.
In all Qualcomm products with Android releases from CAF using the Linux kernel, in a driver function, a value from userspace is not properly validated potentially leading to an out of bounds heap write.
In all Qualcomm products with Android releases from CAF using the Linux kernel, due to a type downcast, a value may improperly pass validation and cause an out of bounds write later.
Memory corruption while invoking IOCTL calls from userspace to camera kernel driver to dump request information.
Memory corruption may occur when invoking IOCTL calls from userspace to the camera kernel driver to dump request information, due to a missing memory requirement check.
Memory corruption while handling schedule request in Camera Request Manager(CRM) due to invalid link count in the corresponding session.
Memory corruption while accessing MSM channel map and mixer functions.
While processing the QCA_NL80211_VENDOR_SUBCMD_SET_TXPOWER_SCALE_DECR_DB vendor command, in which attribute QCA_WLAN_VENDOR_ATTR_TXPOWER_SCALE_DECR_DB contains fewer than 1 byte, in Android for MSM, Firefox OS for MSM, and QRD Android before 2017-08-11 a buffer overrun occurs.
Memory corruption when invalid input is passed to invoke GPU Headroom API call.
Buffer overwrite in the WLAN host driver by leveraging a compromised WLAN FW
Memory corruption while invoking IOCTL calls from user space to issue factory test command inside WLAN driver.
Memory corruption while invoking IOCTL calls from user space to read WLAN target diagnostic information.
In msm_ispif_config_stereo() in Android for MSM, Firefox OS for MSM, and QRD Android before 2017-06-21, the parameter params->entries[i].vfe_intf comes from userspace without any bounds check which could potentially result in a kernel out-of-bounds write.
Memory corruption while processing frame packets.
Possible out of bound read or write in VR service due to lack of validation of DSP selection values in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT
Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Possible memory corruption due to improper validation of memory address while processing user-space IOCTL for clearing Filter and Route statistics in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Memory corruption while passing untrusted/corrupted pointers from DSP to EVA.
Memory corruption when BTFM client sends new messages over Slimbus to ADSP.
Memory corruption when user provides data for FM HCI command control operations.
Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file.
Memory corruption during session sign renewal request calls in HLOS.
Memory corruption when keymaster operation imports a shared key.
Memory corruption when size of buffer from previous call is used without validation or re-initialization.
Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager.
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
Memory corruption when the channel ID passed by user is not validated and further used.
Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Possible memory corruption due to lack of bound check of input index in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Possible buffer overflow due to improper validation of FTM command payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Improper length check of public exponent in RSA import key function could cause memory corruption. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Integer overflow to buffer overflow due to lack of validation of event arguments received from firmware. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, IPQ8074, MDM9607, MSM8917, MSM8920, MSM8937, MSM8940, QCN7605, QCS405, QCS605, SDA845, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.
Memory corruption while sound model registration for voice activation with audio kernel driver.