Memory corruption when allocating and accessing an entry in an SMEM partition.
Memory corruption when keymaster operation imports a shared key.
Memory Corruption in SPS Application while exporting public key in sorter TA.
Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.
Memory corruption while processing IPA statistics, when there are no active clients registered.
Memory corruption when size of buffer from previous call is used without validation or re-initialization.
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
Memory corruption when the channel ID passed by user is not validated and further used.
Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.
Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible buffer overflow due to lack of validation for the length of NAI string read from EFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Possible buffer overflow due to lack of input IB amount validation while processing the user command in Snapdragon Auto
Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
Possible stack overflow due to improper validation of camera name length before copying the name in VR Service in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT
Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Improper validation of buffer size input to the EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Improper validation of maximum size of data write to EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Possible heap Memory Corruption Issue due to lack of input validation when sending HWTC IQ Capture command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
When a fake broadcast/multicast 11w rmf without mmie received, since no proper length check in wma_process_bip, buffer overflow will happen in both cds_is_mmie_valid and qdf_nbuf_trim_tail in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8937, MSM8996AU, MSM8998, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS605, SDM630, SDM636, SDM660, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.
Memory corruption while processing IOCTL handler in FastRPC.
Memory corruption while querying module parameters from Listen Sound model client in kernel from user space.
Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.
Memory corruption when the bandpass filter order received from AHAL is not within the expected range.
Memory corruption while processing TPC target power table in FTM TPC.
Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P
Memory corruption while processing data packets in diag received from Unix clients.
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while processing packet data with exceedingly large packet.
Memory corruption while processing manipulated payload in video firmware.
Memory corruption while executing timestamp video decode command with large input values.
u'Possible buffer overflow in WIFI hal process due to copying data without checking the buffer length' in Snapdragon Auto, Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile in QCM4290, QCS4290, QM215, QSM8350, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SC8180X, SC8180XP, SDX55, SDX55M, SM4250, SM4250P, SM6115, SM6115P, SM6125, SM6250, SM6350, SM7125, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SM8350, SM8350P, SXR2130, SXR2130P
Memory corruption may occur while reading board data via IOCTL call when the WLAN driver copies the content to the provided output buffer.
Memory corruption when programming registers through virtual CDM.
Memory corruption while processing message content in eAVB.
Memory corruption while processing a message, when the buffer is controlled by a Guest VM, the value can be changed continuously.
Memory corruption while processing image encoding, when configuration is NULL in IOCTL parameter.
Possible buffer overflow due to improper validation of index value while processing the plugin block in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Memory corruption due to improper input validation while processing IO control which is nonstandard in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Wired Infrastructure and Networking
Memory corruption while processing camera TPG write request.
Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver.
Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption while copying the result to the transmission queue in EMAC.