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Vulnerability Details :

CVE-2024-33055

Summary
Assigner-qualcomm
Assigner Org ID-2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At-06 Jan, 2025 | 10:33
Updated At-06 Jan, 2025 | 14:18
Rejected At-
Credits

Use After Free in Computer Vision

Memory corruption while invoking IOCTL calls to unmap the DMA buffers.

Vendors
-
Not available
Products
-
Metrics (CVSS)
VersionBase scoreBase severityVector
Weaknesses
Attack Patterns
Solution/Workaround
References
HyperlinkResource Type
EPSS History
Score
Latest Score
-
N/A
No data available for selected date range
Percentile
Latest Percentile
-
N/A
No data available for selected date range
Stakeholder-Specific Vulnerability Categorization (SSVC)
▼Common Vulnerabilities and Exposures (CVE)
cve.org
Assigner:qualcomm
Assigner Org ID:2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
Published At:06 Jan, 2025 | 10:33
Updated At:06 Jan, 2025 | 14:18
Rejected At:
▼CVE Numbering Authority (CNA)
Use After Free in Computer Vision

Memory corruption while invoking IOCTL calls to unmap the DMA buffers.

Affected Products
Vendor
Qualcomm Technologies, Inc.Qualcomm, Inc.
Product
Snapdragon
Platforms
  • Snapdragon Auto
  • Snapdragon Compute
  • Snapdragon Consumer IOT
  • Snapdragon Industrial IOT
  • Snapdragon Mobile
Default Status
unaffected
Versions
Affected
  • FastConnect 6900
  • FastConnect 7800
  • QAM8295P
  • QCA6574AU
  • QCA6696
  • QCM8550
  • QCS6490
  • QCS8550
  • Qualcomm Video Collaboration VC3 Platform
  • SA6145P
  • SA6150P
  • SA6155P
  • SA8145P
  • SA8150P
  • SA8155P
  • SA8195P
  • SA8295P
  • SD 8 Gen1 5G
  • SG8275P
  • SM8550P
  • Snapdragon 8 Gen 2 Mobile Platform
  • Snapdragon 8 Gen 3 Mobile Platform
  • Snapdragon 8+ Gen 2 Mobile Platform
  • Snapdragon AR2 Gen 1 Platform
  • SSG2115P
  • SSG2125P
  • SXR1230P
  • SXR2230P
  • SXR2250P
  • WCD9380
  • WCD9385
  • WCD9390
  • WCD9395
  • WSA8830
  • WSA8832
  • WSA8835
  • WSA8840
  • WSA8845
  • WSA8845H
Problem Types
TypeCWE IDDescription
CWECWE-416CWE-416 Use After Free
Type: CWE
CWE ID: CWE-416
Description: CWE-416 Use After Free
Metrics
VersionBase scoreBase severityVector
3.16.7MEDIUM
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Version: 3.1
Base score: 6.7
Base severity: MEDIUM
Vector:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
https://docs.qualcomm.com/product/publicresources/securitybulletin/january-2025-bulletin.html
N/A
Hyperlink: https://docs.qualcomm.com/product/publicresources/securitybulletin/january-2025-bulletin.html
Resource: N/A
▼Authorized Data Publishers (ADP)
CISA ADP Vulnrichment
Affected Products
Metrics
VersionBase scoreBase severityVector
Metrics Other Info
Impacts
CAPEC IDDescription
Solutions
Configurations
Workarounds
Exploits
Credits
Timeline
EventDate
Replaced By
Rejected Reason
References
HyperlinkResource
Information is not available yet
▼National Vulnerability Database (NVD)
nvd.nist.gov
Source:product-security@qualcomm.com
Published At:06 Jan, 2025 | 11:15
Updated At:11 Aug, 2025 | 15:06

Memory corruption while invoking IOCTL calls to unmap the DMA buffers.

CISA Catalog
Date AddedDue DateVulnerability NameRequired Action
N/A
Date Added: N/A
Due Date: N/A
Vulnerability Name: N/A
Required Action: N/A
Metrics
TypeVersionBase scoreBase severityVector
Secondary3.16.7MEDIUM
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Primary3.17.8HIGH
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Type: Secondary
Version: 3.1
Base score: 6.7
Base severity: MEDIUM
Vector:
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Type: Primary
Version: 3.1
Base score: 7.8
Base severity: HIGH
Vector:
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
CPE Matches
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6900_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_6900>>-
cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_7800_firmware>>-
cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>fastconnect_7800>>-
cpe:2.3:h:qualcomm:fastconnect_7800:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qam8295p_firmware>>-
cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qam8295p>>-
cpe:2.3:h:qualcomm:qam8295p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6574au_firmware>>-
cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6574au>>-
cpe:2.3:h:qualcomm:qca6574au:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6696_firmware>>-
cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qca6696>>-
cpe:2.3:h:qualcomm:qca6696:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm8550_firmware>>-
cpe:2.3:o:qualcomm:qcm8550_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcm8550>>-
cpe:2.3:h:qualcomm:qcm8550:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs6490_firmware>>-
cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs6490>>-
cpe:2.3:h:qualcomm:qcs6490:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs8550_firmware>>-
cpe:2.3:o:qualcomm:qcs8550_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>qcs8550>>-
cpe:2.3:h:qualcomm:qcs8550:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>video_collaboration_vc3_platform_firmware>>-
cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>video_collaboration_vc3_platform>>-
cpe:2.3:h:qualcomm:video_collaboration_vc3_platform:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa6145p_firmware>>-
cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa6145p>>-
cpe:2.3:h:qualcomm:sa6145p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa6150p_firmware>>-
cpe:2.3:o:qualcomm:sa6150p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa6150p>>-
cpe:2.3:h:qualcomm:sa6150p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa6155p_firmware>>-
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa6155p>>-
cpe:2.3:h:qualcomm:sa6155p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8145p_firmware>>-
cpe:2.3:o:qualcomm:sa8145p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8145p>>-
cpe:2.3:h:qualcomm:sa8145p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8150p_firmware>>-
cpe:2.3:o:qualcomm:sa8150p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8150p>>-
cpe:2.3:h:qualcomm:sa8150p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8155p_firmware>>-
cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8155p>>-
cpe:2.3:h:qualcomm:sa8155p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8195p_firmware>>-
cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8195p>>-
cpe:2.3:h:qualcomm:sa8195p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8295p_firmware>>-
cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sa8295p>>-
cpe:2.3:h:qualcomm:sa8295p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_8_gen1_5g_firmware>>-
cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sd_8_gen1_5g>>-
cpe:2.3:h:qualcomm:sd_8_gen1_5g:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sg8275p_firmware>>-
cpe:2.3:o:qualcomm:sg8275p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sg8275p>>-
cpe:2.3:h:qualcomm:sg8275p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8550p_firmware>>-
cpe:2.3:o:qualcomm:sm8550p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>sm8550p>>-
cpe:2.3:h:qualcomm:sm8550p:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_2_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_8_gen_2_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_2_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_8_gen_2_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_3_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_8_gen_3_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8_gen_3_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_8_gen_3_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8\+_gen_2_mobile_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_8\+_gen_2_mobile_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_8\+_gen_2_mobile>>-
cpe:2.3:h:qualcomm:snapdragon_8\+_gen_2_mobile:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_ar2_gen_1_firmware>>-
cpe:2.3:o:qualcomm:snapdragon_ar2_gen_1_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>snapdragon_ar2_gen_1>>-
cpe:2.3:h:qualcomm:snapdragon_ar2_gen_1:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ssg2115p_firmware>>-
cpe:2.3:o:qualcomm:ssg2115p_firmware:-:*:*:*:*:*:*:*
Qualcomm Technologies, Inc.
qualcomm
>>ssg2115p>>-
cpe:2.3:h:qualcomm:ssg2115p:-:*:*:*:*:*:*:*
Weaknesses
CWE IDTypeSource
CWE-416Primaryproduct-security@qualcomm.com
CWE ID: CWE-416
Type: Primary
Source: product-security@qualcomm.com
Evaluator Description
Evaluator Impact

Evaluator Solution

Vendor Statements
References
HyperlinkSourceResource
https://docs.qualcomm.com/product/publicresources/securitybulletin/january-2025-bulletin.htmlproduct-security@qualcomm.com
Patch
Vendor Advisory
Hyperlink: https://docs.qualcomm.com/product/publicresources/securitybulletin/january-2025-bulletin.html
Source: product-security@qualcomm.com
Resource:
Patch
Vendor Advisory

Change History

0
Information is not available yet

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