Possible buffer overflow due to improper input validation in factory calibration and test DIAG command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible assertion in QOS request due to improper validation when multiple add or update request are received simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
Possible buffer overflow due to improper input validation in PDM DIAG command in FTM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible integer overflow to buffer overflow due to improper input validation in FTM ARA commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables
Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Memory corruption while querying module parameters from Listen Sound model client in kernel from user space.
Memory corruption when multiple listeners are being registered with the same file descriptor.
Memory corruption while verifying the serialized header when the key pairs are generated.
Memory corruption in HLOS while checking for the storage type.
Memory corruption when IPC callback handle is used after it has been released during register callback by another thread.
Memory corruption in Automotive Multimedia due to improper access control in HAB.
Memory corruption when more scan frequency list or channels are sent from the user space.
Memory corruption while processing the IOCTL FM HCI WRITE request.
Memory corruption when the bandpass filter order received from AHAL is not within the expected range.
Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP.
Memory corruption while copying the sound model data from user to kernel buffer during sound model register.
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Memory corruption when malformed message payload is received from firmware.
Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node.
Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130
Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150
Integer overflow to buffer overflow due to lack of validation of event arguments received from firmware. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, IPQ8074, MDM9607, MSM8917, MSM8920, MSM8937, MSM8940, QCN7605, QCS405, QCS605, SDA845, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Locked regions may be modified through other interfaces in secure boot loader image due to improper access control. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130, SXR2130
HLOS could corrupt CPZ page table memory for S1 managed VMs in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130
If a bitmap file is loaded from any un-authenticated source, there is a possibility that the bitmap can potentially cause stack buffer overflow. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in APQ8016, APQ8096AU, APQ8098, MDM9205, MSM8996AU, MSM8998, Nicobar, QCS405, QCS605, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Memory corruption in Audio when SSR event is triggered after music playback is stopped.
Memory corruption while using the UIM diag command to get the operators name.
Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.
Memory Corruption in Audio while invoking callback function in driver from ADSP.
Memory corruption in Audio while processing the VOC packet data from ADSP.
Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
Memory corruption in Core while processing control functions.
Memory corruption in HLOS while invoking IOCTL calls from user-space.
Buffer overflow due to improper validation of buffer size while IPA driver processing to perform read operation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
Memory corruption in Graphics Driver when destroying a context with KGSL_GPU_AUX_COMMAND_TIMELINE objects queued.
Memory corruption in Audio while processing IIR config data from AFE calibration block.
Memory corruption in Audio while processing RT proxy port register driver.
Memory corruption in DSP Service during a remote call from HLOS to DSP.
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
Memory corruption while processing finish_sign command to pass a rsp buffer.
Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.
Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND.
Memory corruption in HLOS while converting from authorization token to HIDL vector.